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文章來源 : 廣東優(yōu)科檢測 發(fā)表時間:2024-06-04 瀏覽數量:
AEC-Q200 是汽車電子委員會 (Automotive Electronics Council, AEC) 制定的標準,專門用于汽車電子元器件的可靠性測試,包括陶瓷電容器。為了確保陶瓷電容器符合AEC-Q200標準,需要進行一系列測試。這些測試旨在驗證元器件在各種極端條件下的性能和可靠性。
優(yōu)科檢測是具備AEC-Q200標準CNAS全項檢測能力的第三方陶瓷電容器AEC-Q200認證測試機構,接下來為大家介紹陶瓷電容器AEC-Q200認證測試項目及樣品數量要求。
Table 2: Stress Qualifications for Ceramic Capacitors 陶瓷電容器的應力條件 | |||||||||
NO. 序號 | Stress 測試內容 | Reference 測試方法 | Minimum Sample Size Per Lot Depending on Component Size (cm3) | Number of lots 批次 | Accept on Number failed 允許不合格數 | ||||
樣品體積 <10cm3 Sample Size Per 測試樣品數量 | ≧10cm3 ≦330cm3 | >330cm3 | Individual 單個型號 | Family 系列 | |||||
1 | Pre- and Post-Stress Electrical Test 應力測試前后電氣測試 | User Specification. 用戶規(guī)范 | 除非另有規(guī)定,所有認證器件 All qualification components unless otherwise specified | 0 Fails | |||||
2 | Temperature Cycling 溫度循環(huán) | JESD22-A104 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
3 | Destructive Physical Analysis 破壞性物理分析 | EIA-469 | 10 | 5 | 3 | 1 | 3 | 0 Fails | |
4 | Humidity Bias 高溫高濕 | MIL-STD-202 Method 103 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
5 | High Temperature Operating Life 高溫工作壽命 | MIL-STD-202 Method 108 | 77 | 26 | 10 | 1 | 3 | 0 Fails | |
6 | External Visual 外觀檢查 | MIL-STD-883 Method 2009 | 所有認證器件 All qualification parts submitted for testing | 0 Fails | |||||
7 | Physical Dimension 尺寸檢查 | JESD22-B100 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
8 | Terminal Strength(THT) 端子強度 | MIL-STD-202 Method 211 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
9 | Resistance to Solvents 耐溶劑測試 | MIL-STD-202 Method 215 | 5 | 4 | 3 | 1 | 3 | 0 Fails | |
10 | Mechanical Shock 機械沖擊 | MIL-STD-202 Method 213 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
11 | Vibration 振動 | MIL-STD-202 Method 204 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
12 | Resistance to Soldering Heat 耐焊接熱 | MIL-STD-202 Method 210 | 30 | 4 | 3 | 1 | 3 | 0 Fails | |
13 | ESD ESD靜電測試 | AEC-Q200-002 | 15 | 6 | 3 | 1 | 3 | 0 Fails | |
14 | Solderability 可焊性 | J-STD-002 | 15 each condition | 6 | 3 | 1 | 3 | 0 Fails | |
15 | Electrical Characterization 電氣特性 | User Specification. | 30 | 10 | 4 | 3 | 3 | 0 Fails | |
16 | Board Flex (SMD) 板彎曲(貼片) | AEC-Q200-005 | 30 | 10 | 4 | 1 | 3 | 0 Fails | |
17 | Terminal Strength (SMD) 引出端強度(貼片) | AEC-Q200-006 | 30 | 10 | 4 | 1 | 3 | 0 Fails |
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